HAYASHI GROUP
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Thermal Engineering Dept.
TEL:0439-66-1789
E-mail:reinetsu@htkgp.co.jp
Electronic cooling TKG-311-130
Specifications


Cooling System Electronic cooling system
Dimensions(mm) 120(W)×100(D)×79(H)
Cooling Plate Dimensions(mm) 80×80
Cooling Plate Surface Temperature *1 -16 degrees Celsius to 80 degrees Celsius
Max. Voltage DC12.0V
Max. Current 6.0A
Max. Heat Sink *2 31W
Heat Release System Fan motor DC12V
Appearance Drawing
*1Cooling Plate Surface Temperature can be +100degree Celsius with other frame material.
(except TKG-9002-100,HMC-10F-0200)
*2Max endothermic value (Max .Heat Sink) is measured at 25℃ ambient temperature with no temperature gap between cooling board and ambient temperature.