HAYASHI GROUP
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Thermal Engineering Dept.
TEL:0439-66-1789
E-mail:reinetsu@htkgp.co.jp
Water-cooling HMC-12W-0100
Specifications


Cooling System Water cooling system
Dimensions(mm) 120(W)×100(D)×36(H)
Cooling Plate Dimensions(mm) 80×80
Cooling Plate Surface Temperature *3 -25 degrees Celsius to 80 degrees Celsius
Max. Voltage DC12V
Max. Current 6.0A
Max. Heat Sink *4 41W
Appearance Drawing
*3Cooling Plate Surface Temperature can be +100degree Celsius with other frame material.
(except TKG-9002-100,HMC-10F-0200)
*4Max Volume of heat absorption is when Water temperature at dissipated heat side is +20℃ with 3L/m flow, and Temperature difference between hot side and cool side is 0 ℃.