HAYASHI GROUP
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Thermal Engineering Dept.
TEL:0439-66-1789
E-mail:reinetsu@htkgp.co.jp
Electronic cooling HMC-10F-0100
Specifications


Cooling System Electronic cooling system
Dimensions(mm) 186(W)×124(D)×86(H)
Cooling Plate Dimensions(mm) 140×70
Cooling Plate Surface Temperature -16 degrees Celsius to 100 degrees Celsius
Max. Voltage DC12.0V
Max. Current 12.0A
Max. Heat Sink *2 49.0W
Heat Release System Fan motor DC12.0V
Appearance Drawing
*2Max endothermic value (Max .Heat Sink) is measured at 25℃ ambient temperature with no temperature gap between cooling board and ambient temperature.